| Emissor | Sendai Domain |
|---|---|
| Ano | 1784 |
| Tipo | Coin pattern |
| Valor | 1 Mon |
| Moeda | Mon (1784-1863) |
| Composição | Copper (Copper alloy) |
| Peso | |
| Diâmetro | |
| Espessura | |
| Formato | Square with rounded corners (With a square hole) |
| Técnica | Cast |
| Orientação | |
| Gravador(es) | |
| Em circulação até | |
| Referência(s) |
| Descrição do anverso | Four characters around center hole |
|---|---|
| Escrita do anverso | |
| Legenda do anverso |
仙 寶 通 臺 (Translation: Sendai Currency) |
| Descrição do reverso | Blank. |
| Escrita do reverso | |
| Legenda do reverso | |
| Bordo | |
| Casa da moeda | |
| Tiragem |
ND (1784) - - |
| ID Numisquare | 1086945140 |
| Informações adicionais |
Historical Context: Issued in 1784, this 1 Mon 'Sendai-tsūhō' Bosen falls within the Edo period's Tenmei era (1781-1789). The powerful Sendai Domain, in Mutsu Province, was under Date Shigemura (1756-1796), its 7th *daimyō*. This period saw the devastating Tenmei Famine, severely impacting Japan, including Tohoku. Local domains like Sendai minted *bosen* (local currency) to facilitate regional trade and alleviate economic distress, supplementing central *Kan'ei Tsūhō* issues.
Artistry: Specific engraver attribution for Edo-period *bosen* is rare, and none is known for this Sendai issue. The "仙台通寶" (Sendai-tsūhō) inscription's calligraphy adheres to the standard *kaisho* (regular script) prevalent on Japanese cash coins, influenced by classical Chinese prototypes. *Bosen* often exhibit minor variations in character execution and aesthetic quality, reflecting the decentralized nature of local minting compared to standardized central government issues.
Technical/Grading: For this copper alloy 'small type' 1 Mon 'Sendai-tsūhō' Bosen, key grading points include clarity and sharpness of the four obverse characters, especially inner strokes. Definition of both inner and outer rims should be strong. Minor casting flaws, common for *bosen*, should not obscure critical design elements. Original patination and surface integrity, free from excessive corrosion or damage, are crucial for higher grades, alongside adherence to the specific "small type" module.